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Multi-Row Photoresist Lamination for Thin Film Dimensional Stability

IP.com Disclosure Number: IPCOM000037283D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Larnerd, JD Marconi, F Sakorafos, K [+details]

Abstract

Disclosed is a process which significantly reduces the dimensional stability problems introduced by lamination dry film resist systems to thin film materials (both in roll and panel formats).