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Disclosed is a process which significantly reduces the dimensional stability problems introduced by lamination dry film resist systems to thin film materials (both in roll and panel formats).
English (United States)
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Multi-Row Photoresist Lamination for Thin Film Dimensional Stability
Disclosed is a process which significantly reduces the dimensional stability
problems introduced by lamination dry film resist systems to thin film materials
(both in roll and panel formats).
Thin film products face a unique challenge with respect to maintaining
dimensional stability control following dry film resist application. Due to the
extreme "thinness" of the base KAPTON* material (2-5 mils), the resist system
(3-5 mils total thickness with protective carrier) greatly influences the overall
dimensional stability of the resist clad product. The thin film build format
incorporating numerous narrow product strips (35 mm or greater) in multiple rows
across a continuous panel/roll width (7 inches and greater) highlights the need
for a tightly controlled, dimensionally stable process through resist lamination.
Industry direction for resist film lamination, however, has primarily focused on
much thicker, more dimensionally stable card/board applications. As a result, the
dimensional stresses imparted to the product by the resist system have gone
largely unnoticed and unaddressed.
By sectioning the resist web from one continuous width into multiple narrower
rows just prior to lamination (see the figure), the accumulated stresses induced
across the product width by the resist web are significantly reduced. This multi-
row technique may be performed either by slitting a full width resist film just...