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Selective Molten Solder Applicator for Arrays Disclosure Number: IPCOM000037285D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Apap, J Cobb, J Downes, FJ House, LD Nelson, RF Umhauer, T Shutts, L [+details]


Disclosed is a method to transfer molten solder to an array of separate, tightly spaced solderable surfaces. This method will deposit a controlled volume of solder on each separate solderable surface without causing "bridging" (solder connection, not by design, between two separate electrically isolated solderable surfaces).