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Protection of Sensitive Materials During Photoresist Stripping Disclosure Number: IPCOM000037338D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

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Mann, RW [+details]


To avoid damage to sensitive unprotected areas caused by standard photoresist stripping methods, an inorganic masking layer is used in a manner which provides protection for the sensitive materials during standard photoresist stripping.