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Design for Input and Output Verification Disclosure Number: IPCOM000037352D
Original Publication Date: 1989-Dec-01
Included in the Prior Art Database: 2005-Jan-29

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Doorduin, W Jung, D [+details]


Module in place (MIP) testing is done in the card assembly plant, immediately after the solder process. The purpose of this test is to detect manufacturing defects, such as: 1. Shorts/Opens 2. Wrong/Missing Components 3. Misplaced Components 4. Defective Components (usually I/O defects)