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A novel heat exchange which can use the existing manufacturing tools for attachment is described.
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
88% of the total text.
Page 1 of 1
Thermal Enhancement for Marginal Electronic Devices
A novel heat exchange which can use the existing manufacturing tools for
attachment is described.
An aluminum or copper heat sink which has leads identical to those of a 68
Plastic Leaded Circuit Component (PLCC) is described.
The heat sink would be surface mountable with pad locations identical to the
68-lead PLCC. The existing pick and place machines could be used to place the
component. If reflow problems occur because of the thermal mass of the heat
sink, a plastic cover could be placed over it to reduce its heat dissipation and
replicate the 68-lead PLCC during attachment.
The heat sink could be attached to the backside of the card (opposite side
from a Tape Automated Bonded (TAB) component just, as shown in Fig. 1).
TAB is a candidate for this heat exchanger configuration for several reasons.
First, the TABs are thermally marginal. Secondly, present heat exchangers
require special processes for attachment. Also, active and pin-through
components will not be allowed behind the TAB. Furthermore, TABs conduct
most of their heat into the card.
The effect of placing unpowered surface mounted (plastic) components
behind a powered component was observed during thermal evaluations. The
change in the external thermal resistance of the powered component was
lowered approximately 5-10% depending on the particular module. Using a
component which is not coated with plastic would result in a larger reduction in