Insert Layer for Surface Mount Components
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29
During thermal cycling, there is risk of failure of the solder joints for a surface mounted pinned component as shown in Fig. 1. The failure is due to large displacements, caused by a mismatch in the thermal expansion coefficient between the card and the module, at the corner solder joints.