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Thermally Enhanced Printed Circuit for Natural Convection

IP.com Disclosure Number: IPCOM000037427D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Appelt, BK Memis, I [+details]

Abstract

A typical printed circuit has a capability for power dissipation through the electrical circuit itself, and heat that is transferred to the back surface. The heat transfer can be enhanced only by adding heatsinks on either side of the circuit board. Consequently, thickness and volume requirements of the assembly increase.