The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Large Holes for Through Circuit Board Connections

IP.com Disclosure Number: IPCOM000037428D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Leslie, GG Simi, VM Sullivan, JF Williams, GR [+details]


This permits injection molded circuit boards to be fabricated without costly through vias. The board is made by injection molding with inserts or the mold itself defining large holes and edge indentions. Through connections are made by leads plated across the edge of these large openings, each having several, separate leads.