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Browse Prior Art Database

Large Holes for Through Circuit Board Connections

IP.com Disclosure Number: IPCOM000037428D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Leslie, GG Simi, VM Sullivan, JF Williams, GR [+details]

Abstract

This permits injection molded circuit boards to be fabricated without costly through vias. The board is made by injection molding with inserts or the mold itself defining large holes and edge indentions. Through connections are made by leads plated across the edge of these large openings, each having several, separate leads.