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Ultra High Vacuum Wafer Shutter

IP.com Disclosure Number: IPCOM000037444D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Deurr, FW Flotta, MS Morgan, FP Sandstrom, RL [+details]

Abstract

A technique is described whereby an ultra high vacuum wafer shutter is implemented in a process chamber, during a semiconductor fabrication process, to cover process wafers, so as to eliminate the need for double pumped O-ring seals and expensive ferro-fluidic feedthru components.