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Laser-Welded Thermocouple for In-Situ Temperature Measurement Disclosure Number: IPCOM000037456D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

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Related People

Jackson, MW Nguyen, DQ [+details]


Temperature measurement is often a critical process control parameter for electronic component assembly and packaging. Typically, thermocouples provide this information; however, their effectiveness is currently limited by the attachment technique, usually via adhesive or arc-welding (spot welding). Disclosed is a technique to acquire precise and accurate in-situ temperatures of a variety of substrates (circuit cards, silicon chips, ceramics, metal surfaces) which can then be used to enhance development and manufacturing processes.