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Organometallic Lead Finish for Tape Automated Bonding

IP.com Disclosure Number: IPCOM000037458D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Nguyen, DQ Puligandla, V [+details]

Abstract

Tape automated bonding (TAB) device leads are either tin plated or gold plated to enhance solderability to the substrate. Tin plating on the leads is susceptible to whisker growth, and gold plating can cause joint embrittlement depending upon the initial gold thickness on the leads, the solder volume, and the number of repairs experienced.