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Solder Flux Used As Adhesive Holding Component to Board Eliminates Clinching

IP.com Disclosure Number: IPCOM000037465D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Cooper, SA Douthitt, BL [+details]

Abstract

A small amount of solder flux, of the proper viscosity, placed on component leads just prior to insertion into holes in the circuit board, acts as an adhesive to hold the component in place during the subsequent soldering operation. This eliminates the need for a clinching operation.