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Thermally Conductive Electrical Isolation Wafer

IP.com Disclosure Number: IPCOM000037485D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Pavelka, JB [+details]

Abstract

It is proposed to use a ceramic wafer to provide electrical isolation to electronic cooling systems. One side of the wafer is polished and the other is metallized. A solder or braze joint is used to join the wafer to the cooling device.