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Cooling for Circuit Module with High Powered Semiconductor Components Located Upstream in the Flow of a Sub-Cooled Liquid to Assure Condensation of Vapor

IP.com Disclosure Number: IPCOM000037490D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chrysler, GM Chu, RC Simons, RE [+details]

Abstract

Semiconductor components are arranged on circuit boards in rows so that an immersing liquid coolant can flow along each row, as is conventional. At the inlet, the coolant temperature is sufficiently below the temperature of vaporization that the total heat load of the components can be handled without vaporizing the liquid. However, some of the components operate at high power and cause the liquid to vaporize locally. Other components operate at low power and do not cause vaporization.