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Self-Aligned Repair of Open Circuits

IP.com Disclosure Number: IPCOM000037504D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chen, J Gupta, A von Gutfeld, RJ [+details]

Abstract

A technique is described for repairing circuits that are completely open. A doped precursor is applied in the vicinity of the break, for example, copper formate, doped with a small amount of polydiacetylene, or polythiophene. The material is slightly conducting. By passing a current through the line, the gap region is heated up preferentially, which will drive out the organic binders to leave copper deposition in the local region between the ends of the gap. The remaining organic material can be washed away with water. The substrate is then submerged in copper sulfate solution and an AC current is applied to produce heat which induces thermobattery plating to build up the line thickness and conductivity. In this way, the break is repaired in two self-aligning, self-limiting steps.