Browse Prior Art Database

Improved Substrate Bonding

IP.com Disclosure Number: IPCOM000037506D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chu, MC Grebe, K Miersch, E Park, J Tong, HM [+details]

Abstract

Disclosed is an approach for hot pressing two electronic structures together using a 3-component adhesive system which (1) fills the fine spaces between active electronic components in the structures during hot pressing and (2) possesses sufficient thickness uniformity required by optimal electrical performance after hot pressing.