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Improved Substrate Bonding Disclosure Number: IPCOM000037506D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

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Chu, MC Grebe, K Miersch, E Park, J Tong, HM [+details]


Disclosed is an approach for hot pressing two electronic structures together using a 3-component adhesive system which (1) fills the fine spaces between active electronic components in the structures during hot pressing and (2) possesses sufficient thickness uniformity required by optimal electrical performance after hot pressing.