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Wafer Bending Control for Packaging and Chip Applications Disclosure Number: IPCOM000037511D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Hu, CK Nguyen, L Tong, HM Yeh, H [+details]


Disclosed are three approaches for controlling the bending of any substrate, e.g., a silicon wafer, during fabrication of polymer/metal films.