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Disclosed are three approaches for controlling the bending of any substrate, e.g., a silicon wafer, during fabrication of polymer/metal films.
English (United States)
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Wafer Bending Control for Packaging and Chip Applications
Disclosed are three approaches for controlling the bending of any substrate,
e.g., a silicon wafer, during fabrication of polymer/metal films.
The three approaches require the use of, respectively, a stress compensated
coating, whether metallic or non-metallic, on the back side of the wafer (as
opposed to the front side coated by polymer/metal films), a polymer with low
thermal expansion coefficients (and therefore a lower stress level), and a thick
silicon wafer which does not bend. The thick wafer is used throughout film
processing, while the back coating and low expansion polymer approaches can
be applied whenever wafer bending is unacceptable.