Browse Prior Art Database

Wafer Bending Control for Packaging and Chip Applications

IP.com Disclosure Number: IPCOM000037511D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Hu, CK Nguyen, L Tong, HM Yeh, H [+details]

Abstract

Disclosed are three approaches for controlling the bending of any substrate, e.g., a silicon wafer, during fabrication of polymer/metal films.