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Enhanced Characteristics in Laminated Layers

IP.com Disclosure Number: IPCOM000037523D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chen, YT Gini, D Hastings, LD Newton, BA [+details]

Abstract

A thermoplastic dielectric film coated onto a metal foil backing is used to laminate and isolate layered electrical circuits.