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Technique for Improving Adhesion and Throughput in the Manufacture of Large Printed Circuit Boards

IP.com Disclosure Number: IPCOM000037534D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Samuelson, CE [+details]

Abstract

The new technology large boards require electrically isolated module sites for separate power feeds using drilled copper foil. To obtain electrically isolated module sites, it is necessary to have an intermediate lamination step where the prepreg is used for mechanical strength on completion of the second isolation border.