Browse Prior Art Database

Back-To-Back Wafer Load/Unload Tool

IP.com Disclosure Number: IPCOM000037543D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Maimon, JD Springer, LK [+details]

Abstract

This article discloses a tool for picking up two wafers at a time, back-to-back. Referring to the figure, the tool 10 picks up wafers 12 by edge 14 where it contacts a "V" notch 16 cut into the soft plastic "bumpers" 18 on the tool. Squeezing the handle 20 causes the "bumpers" 18 to separate so that they can be positioned over the wafer. A double loop spring coil 22 provides tension to hold the wafers after the handle grip is reduced.