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Tungsten-Glass Bonding Process

IP.com Disclosure Number: IPCOM000037576D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Lane, R [+details]

Abstract

Improved bonding and heat transfer between tungsten and its glass substrate is achieved by depositing a strongly adhering oxide onto a tungsten film and uniting the coated tungsten to the glass with heat in an electric field.