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A method to accurately locate the fiducial marks on the printed circuit panel to aid accurate placement of Tape Automated Bonding devices is described.
English (United States)
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Use of Fluorescent Material in the Panel Substrate to Aid Accurate
Placement of Tape Automated Bonding Devices (TAB)
A method to accurately locate the fiducial marks on the printed circuit panel
to aid accurate placement of Tape Automated Bonding devices is described.
Fiducial marks are generally copper dots at specified locations on the
substrate and are used by the placement device as reference points for accurate
placement of components on their respective footprints. The fiducials should be
bright enough to be optically located by the placement tool. Since the TAB
device is placed and attached last following the vapor phase and wave solder
operation the copper fiducials are either oxidized or covered with solder and
become unusable as locators.
A fluorescent dye is incorporated into the substrate polymer matrix, namely,
the epoxy-glass under the copper. A beam of ultraviolet light is directed onto the
fiducial on the panel. Due to the fluorescent nature of the dye a bright halo will
be generated around the copper fiducial mark. This bright outline of the fiducial
can then be picked up by the camera and used as the locator mark. This bright
fluorescent glow is independent of the surface condition of the fiducial mark.
The method described eliminates the cleaning, and/or protection of the
fiducial marking prior to placement of the TAB.