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Improved mechanical bonding and electrical continuity is obtained between strips of thin metal film by splicing the strips with copper preforms coated with gold/tin solder and flux.
English (United States)
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Thin Film Splicing
Improved mechanical bonding and electrical continuity is obtained between
strips of thin metal film by splicing the strips with copper preforms coated with
gold/tin solder and flux.
Referring to the figure, copper preforms 1, 2 are given a coat of gold/tin
solder and dried flux on one surface and one preform is placed with coated side
up on fixture 3 with pins 4. Edge perforated strips 5, 6 of thin metal film, usually
copper, are butted together and placed over preform 1 and pins 4. Second
preform 2 is placed over the joint with its coated side down, and sufficient heat is
applied from duct 7 to reflow the solder. The soldering process forms a
metallurgically sound joint with excellent electrical continuity. The gold/tin solder
avoids contamination of subsequent plating baths when the joined strips are