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Thin Film Splicing

IP.com Disclosure Number: IPCOM000037607D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Lord, KC Moore, RJ [+details]

Abstract

Improved mechanical bonding and electrical continuity is obtained between strips of thin metal film by splicing the strips with copper preforms coated with gold/tin solder and flux.