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Dual Polyimide Lift-Off Stencil for Thin/Thick Film Metallurgy

IP.com Disclosure Number: IPCOM000037609D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Fitzsimmons, JA Perfecto, ED Prabhu, SS [+details]

Abstract

This article concerns a process improvement yielding a 10.5 um rack-free lift-off stencil film for substrate applications.