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A method of repairing electrical opens in metal circuitry is disclosed. The method makes use of the known tendency of certain organic compounds to polymerize at the anode of an electrochemical cell.1
English (United States)
This text was extracted from a PDF file.
This is the abbreviated version, containing approximately
90% of the total text.
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Circuit Repair by Electropolymerization of a Conductive Polymer
A method of repairing electrical opens in metal circuitry is disclosed. The
method makes use of the known tendency of certain organic compounds to
polymerize at the anode of an electrochemical cell.1
Compounds such as aniline, thiophene, pyrrole, furan and other aromatic and
heteroaromatic species undergo an electropolymerization at various electrode
potentials. The anodic electropolymerization has been shown to result in an
oxidized polymer somewhat similar to that obtained by oxidizing or p-doping
poly(acetylene). Conductivities as high as 500 S/cm have been obtained with, for
example, poly(thiophene).2 The polymer is normally grown as a film on the
In order to use these materials for circuit repair, it is only necessary to
connect the metal lines to be repaired to a power supply and expose them to a
droplet of solution containing the monomer and a supporting electrolyte. The
counterelectrode, e.g., a platinum wire, can be contained in the droplet as well by
threading it through the capillary tube supporting the droplet. Under the oxidizing
potential applied to the metal lines, the polymer film is deposited, eventually
bridging the gap. The polymer is deposited in the oxidized, conductive form so
that, except for a rinse to remove traces of the solution, the repair is complete.
References: 1. G. P. Kittlesen, H. S. White, and M. S. Wrighton, J. Amer.
Chem. Soc., 106, 7389 (1984);...