Browse Prior Art Database

Piezoelectric Thermode for Thermocompression Shear Bonding

IP.com Disclosure Number: IPCOM000037631D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Noyan, IC Palmer, MJ Reiley, TC [+details]

Abstract

Disclosed is a device which allows thermocompression (TC) gang- bonding of multi-leaded surface mounted devices, particularly for TAB packaging, while simultaneously imposing a shear displacement to the surfaces to be bonded. This device allows the reduction of bonding temperatures and times and limits the vertical deformation (crush) in the bonding sites on the chip (the pads) required for good joints. It achieves these objectives by supplying energy in the form of a shear wave to the structures being joined.