Piezoelectric Thermode for Thermocompression Shear Bonding
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-29
Disclosed is a device which allows thermocompression (TC) gang- bonding of multi-leaded surface mounted devices, particularly for TAB packaging, while simultaneously imposing a shear displacement to the surfaces to be bonded. This device allows the reduction of bonding temperatures and times and limits the vertical deformation (crush) in the bonding sites on the chip (the pads) required for good joints. It achieves these objectives by supplying energy in the form of a shear wave to the structures being joined.