Technique for Enhancing the Performance of a Chip Carrier
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
Present modules are experiencing severe limitations when they are called upon to handle higher technologies involving simultaneously switching fast drivers. These limitations are due to excessive coupled noise and power distribution noise. The present technique describes ways for a single level metal module to reduce significantly both forms of noise and thus extend its performance range.