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Circuit Module With Piston-Like Device Cylindrically Interleaved With a Complementary Water Cooled Structure Disclosure Number: IPCOM000037681D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Eid, JC Zumbrunnen, ML [+details]


Some circuit modules have a thin rectangular chip carrier, chips mounted in an array on the chip carrier, a metal supporting and cooling structure that includes connections to a chilled water supply, and a structure called a piston that releasably contacts a heat transfer surface of the chip and slidably contacts the supporting and cooling structure. For this description the module is oriented with the chip carrier horizontal and the chips on its upper surface.