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Label Sealing Device for Wire Leads

IP.com Disclosure Number: IPCOM000037685D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Cioffi, JM Kettler, M Szabo, L Williams, JH [+details]

Abstract

Figure 1 shows a wire lead 2 with an identifying label 3 attached. When the adhesive backed label 3 is applied from above and the ends brought together, as in previous label apparatus, a gap is created at 4.