Browse Prior Art Database

Thermal Conduction Module (TCM) With Multiple Pistons in Non- Orthogonal Pattern for Additional Surface Area in Contact with Chip and Space Between Chips for Cold Plate Bolt

IP.com Disclosure Number: IPCOM000037688D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Edwards, DL Zumbrunnen, ML [+details]

Abstract

A circuit module called a TCM has a planar substrate that carries an array of chips on one surface, a structure called a "hat" that cooperates with the substrate to form an enclosure for the chips, and "pistons" that fit into cylindrical holes in the hat and are spring loaded to contact the exposed surfaces of the chips. For purposes of terminology, the substrate can be located in a horizontal plane with the chip supporting surface facing up. The hat and the pistons are made of a good thermal conductor such as copper. Heat from the chips is conducted across a gap to the piston, up the piston, and across a second gap to the hat. The hat is cooled by a fluid such as water or air.