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Circuit Module with Heat Transfer from Chip to Cooling Structure Through Piston Containing Water and Tilted at an Angle to Promote Defined Circulation for Vapor and Condensate

IP.com Disclosure Number: IPCOM000037692D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

In some circuit modules, chips are supported in an array on a thin flat substrate and metal pistons contact the outer surface of the chip to conduct heat from the chips to a cooling and supporting structure. In this module, the pistons are hollow and contain a suitable amount of water and air at a suitable low pressure to cause evaporation to occur at a selected temperature. Thus, heat transfer inside the piston occurs partly by convection and the piston can be made longer than a conventional solid piston (which is limited in length by its thermal conduction resistance) for improved heat transfer to the cooling and supporting structure.