Multilevel Resist Process using Sputtered Quartz as Interlayer
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-29
The Multilayer Resist (MLR) technique is used in the fabrication of very high resolution images on semiconductor chips. A specific feature of the MLR technique is the choice of the interlayer material. The purpose of the interlayer material is to provide a barrier to oxygen reactive ion etching (RIE) of the bottom polymer layer. Refer to Fig. 1.