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Module Heat Shield for High Temperature Soldering

IP.com Disclosure Number: IPCOM000037728D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Hillis, L Sholtes, T Tucek, P Woychik, C [+details]

Abstract

The sensitivity of some types of modules to the high temperatures of vapor phase soldering, and the like, can be overcome by the use of heat shields. These heat shields will insulate such heat-sensitive modules quite effectively during the vapor phase soldering step of the assembly process.