Module for Improved Heat Dissipation
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
New generation chips operate at power levels exceeding 20 watts and require advanced thermal packaging to dissipate this heat. Cooling these chips with current thermal grease or RFC designs is not effective. The arrangement of a module as described herein has the high thermal performance dictated by the new generation chips.