Browse Prior Art Database

Technique for Filling Holes With Solder Paste On Thick Boards/Cards

IP.com Disclosure Number: IPCOM000037734D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Sarnacki, FH [+details]

Abstract

Referring to the Figure, a printed circuit board 1 is mounted in a fixture or on a plate using thin standoffs 2 which will support the board around the areas (the hole pattern) to be filled. A thin mask 3 (metal or epoxy glass) with holes slightly larger than the board holes is placed over the board 1. This has the hole pattern matching the holes to be filled regardless of the side from which the connectors will be inserted.