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Solder Ball Reflow Disclosure Number: IPCOM000037737D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue


Related People

Emerick, AJ McAskill, RD Miller, TL Saraiya, MK [+details]


Solder balls can be positioned with wider tolerance and reflowed with improved assurance by placing the balls at respective fluxed locations on a substrate, superpositioning a plate fixture and inverting the assembly during furnace reflow.