Browse Prior Art Database

Solder Ball Reflow

IP.com Disclosure Number: IPCOM000037737D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Emerick, AJ McAskill, RD Miller, TL Saraiya, MK [+details]

Abstract

Solder balls can be positioned with wider tolerance and reflowed with improved assurance by placing the balls at respective fluxed locations on a substrate, superpositioning a plate fixture and inverting the assembly during furnace reflow.