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Ground Plane to Bonding Pad Connection for Tab

IP.com Disclosure Number: IPCOM000037738D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Jordan, DJ Kelleher, RJ [+details]

Abstract

Vias or plated through holes are commonly used to connect the copper interplanes of a multilayered printed circuit board (PCB). One difficulty encountered in such a construction technique is the placement of small features (holes) in the dielectric layer of the PCB. Such holes are very difficult to make small enough to serve their designed purpose. A described technique that achieves interconnection by using a folded lead, thereby eliminating the need for the holes, works as follows.