Improving Pin Pull Strength
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
The connection between I/O pins and a glass-ceramic substrate can be improved by increasing the bonding area between the pin head and substrate. Referring to Fig. 1, the prior art shows a substrate 10 having a metallic bonding pad 12 to which a pin 14 having head 16 is bonded. The brazed area 18 is significantly greater than the area of head 16. This results in large tensile stresses at the edge of metal pad 12 following sintering.