Low Distortion And Defect-Free Transfer of Prefabricated Circuits to Green Sheets
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
A method has been proposed which will avoid delamination or distortion when transferring prefabricated circuits to green sheets for use in multilayer ceramic (MLC) modules in semiconductor devices. Use of a UV sensitive adhesive provides a means of selectively controlling adhesion of the decal release layer.