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Low Distortion And Defect-Free Transfer of Prefabricated Circuits to Green Sheets

IP.com Disclosure Number: IPCOM000037746D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Acocella, J Chance, DA Feger, C Goland, DB Herron, WL Hougham, G Park, JM [+details]

Abstract

A method has been proposed which will avoid delamination or distortion when transferring prefabricated circuits to green sheets for use in multilayer ceramic (MLC) modules in semiconductor devices. Use of a UV sensitive adhesive provides a means of selectively controlling adhesion of the decal release layer.