Reduction/Elimination of Glass-Ceramic Cracks Or Sintering Tears
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29
It is proposed to minimize cracks or tears occurring when glass- ceramic substrates used in semiconductor devices are sintered. The proposal suggests a better match of the thermal coefficient of expansion (TCE) of the contact sheet to the TCE of the substrate thereby reducing stresses at the interface.