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This scheme uses cured resistive ink directly on base metal in place of plated nickel and gold for connector pads on pluggable circuit cards and other types of electronic substrates.
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Low Cost Edge Tabs for Circuit Cards And Hybrid Substrates
This scheme uses cured resistive ink directly on base metal in place of plated
nickel and gold for connector pads on pluggable circuit cards and other types of
A special filled polymer resistor ink is printed over the copper edge connector
pads. The ink is then heat or ultra-violet light cured. These inks can provide up
to millions of insertion cycles of life when mated with connectors on a system
board. The method can be extended to other substrates such as alumina,
porcelain steel, glass ceramic on steel, etc. The resistive ink is applied over thick
film connector pads instead of using a gold plating process or thick film gold or
other previous metals. The ink is special in that it has the necessary wear
resistance and also it protects the pads underneath it from the environment.
Although the ink is resistive, the electrical current path is transverse of the thin
ink layer, so that little resistance is introduced.
In applications where it is possible to use the resistive ink as encapsulate, it
eliminates the need for encapsulated or solder mask process steps in the
manufacturing of the circuits.