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Low Cost Edge Tabs for Circuit Cards And Hybrid Substrates

IP.com Disclosure Number: IPCOM000037752D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-29

Publishing Venue

IBM

Related People

Authors:
Aakalu, NG [+details]

Abstract

This scheme uses cured resistive ink directly on base metal in place of plated nickel and gold for connector pads on pluggable circuit cards and other types of electronic substrates.