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Plastic Package Compatible Back End of the Line Process

IP.com Disclosure Number: IPCOM000037792D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

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Related People

Akiki, G DiToro, J Leonovich, G Nemeth, J [+details]


A process which improves the long term reliability of a plastic package for a high density semiconductor chip is reported.