Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Plastic Package Compatible Back End of the Line Process

IP.com Disclosure Number: IPCOM000037792D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Akiki, G DiToro, J Leonovich, G Nemeth, J [+details]

Abstract

A process which improves the long term reliability of a plastic package for a high density semiconductor chip is reported.