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Browse Prior Art Database

Chip Bussing to Enhance Tab Peformance

IP.com Disclosure Number: IPCOM000037795D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Greer, SE [+details]

Abstract

Busses are formed by deposition masking or lift-off processing while forming normal connector bumps on semiconductor chips. Large cross-section metal busses reduce wiring resistance, thus improving performance of tab connected circuits.