The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Chip Bussing to Enhance Tab Peformance

IP.com Disclosure Number: IPCOM000037795D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue


Related People

Greer, SE [+details]


Busses are formed by deposition masking or lift-off processing while forming normal connector bumps on semiconductor chips. Large cross-section metal busses reduce wiring resistance, thus improving performance of tab connected circuits.