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Alignment Aid for Stud Up Technology

IP.com Disclosure Number: IPCOM000037799D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

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Related People

Cronin, JE [+details]


A semiconductor alignment aid may be formed in a planar surface by placing a vertical metallurgical "stud up" structure generated in the normal process sequence in a large (non-functional) area. The resulting "artificial" valley created on the chip represents the deepest valley on the chip. In so doing, the etching of the studs and insulator result in exposing the stud mask in this area and the stud conductor everywhere else. By wet etching the stud mask preferential from the field and stud metal areas, a topographical alignment aid is created first order to the stud level.