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Method of Etchant Control During Residual Copper Removal Disclosure Number: IPCOM000037806D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

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Canfield, D Lemon, G Malek, R Markovich, V Romanowksi, M [+details]


A photo-resist applied to circuit panels prior to additive plating has been known to break down in the plating process due to high ph and temperature of the plating solution. This permits deposition of residual copper in functional areas on the circuit panel. Such copper deposits are a problem in that they are a potential source of shorts between circuit lines. Such copper deposits cannot be removed using standard etching processes because of the presence of circuit lines which must remain unaffected.