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Z Axis Wire Cut Disclosure Number: IPCOM000037825D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

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Related People

Funk, S Henderson, S Kolan, H [+details]


During the capping process thermal paste is dispensed onto the caps prior to bonding with the substrate, which when bonded with the substrate allows heat from the computer chips to conduct into the cap to cool the substrate. A .003 wire is used to cut the paste after the paste is dispensed. This wire cut assembly is mounted to the base plate and travels back and forth on a fixed plane. Unfortunately, when the wire is on the same plane the caps must be presented to the tool in such a way as to cause the wire to occasionally rake over sites already dispensed on a multi-site cap. The problem can be alleviated by providing Z movement to the product after each dispense operation.