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Defining Locating Studs Through Nontransmissive Films Disclosure Number: IPCOM000037854D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-30

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Cote, WJ Cronin, JE Holland, KL Kaanta, CW Petrillo, EJ Schadt, MJ [+details]


For chip fabrication using tungsten studs as interlevel via material and silicon nitride/silicon dioxide as dielectric on a planarized substrate, an etchback process followed by deposition of a nontransmissive film produces contrasting stud edges for overlay alignment.