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Method of Making Aluminum Nitride Ceramics for Substrate Applications

IP.com Disclosure Number: IPCOM000037866D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Suryanarayana, D [+details]

Abstract

Disclosed is a method for densifying the commercial aluminum nitride (AIN) powders into ceramics that can be used for fabricating the chip carrier products, such as MC, MLC, etc. The AIN ceramic material offers unique advantages, namely a high thermal conductivity and a matched coefficient of thermal expansion with that of silicon. These properties enable the AIN as a potential alternative material to replace the current alumina ceramics from packaging.