Browse Prior Art Database

Thermally Enhanced Surface Mount Modular Tape Automated Bonding Package

IP.com Disclosure Number: IPCOM000037869D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Funari, J Sammakia, BG [+details]

Abstract

A Tape Automated Bonding (TAB) packaging concept consists of a module having improved thermal enhancement, superior handling properties, improved tolerances for high I/O count and better TAB to card joint reliability. The packaging also allows testing. These improvements are accomplished by molding the outer leads of the TAB to a heatsink with a dissolvable organic compound that can be removed after use. The packaging procedure is described in the following.