Browse Prior Art Database

Solder Pad Design for Lead Attach

IP.com Disclosure Number: IPCOM000037878D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

Publishing Venue

IBM

Related People

Authors:
Black, VJ Saraiya, M VanDusen, RL [+details]

Abstract

Disclosed is a self-aligning pad design on an MC substrate to which the leads of a T018/T03 type package are joined. The design provides better joints and reduces alignment problems. In general, it is applicable to any wire to pad attach product requirements.