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Solder Pad Design for Lead Attach Disclosure Number: IPCOM000037878D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-30

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Related People

Black, VJ Saraiya, M VanDusen, RL [+details]


Disclosed is a self-aligning pad design on an MC substrate to which the leads of a T018/T03 type package are joined. The design provides better joints and reduces alignment problems. In general, it is applicable to any wire to pad attach product requirements.